发明名称 |
POLYPHENYLENE ETHER RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a polyphenylene resin composition that has a low dielectric loss tangent and thus is suitably useful, for example, for a printed wiring board corresponding to the densification of wiring, a higher frequency signal etc. SOLUTION: The polyphenylene resin composition comprises (A) an epoxidized polyphenylene ether resin having a polyphenylene ether backbone part and (B) an aromatic vinyl compound-maleic anhydride copolymer having an aromatic vinyl backbone part. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009024064(A) |
申请公布日期 |
2009.02.05 |
申请号 |
JP20070187358 |
申请日期 |
2007.07.18 |
申请人 |
ASAHI KASEI CHEMICALS CORP |
发明人 |
SAKURAI MINORU;ONIZUKA KENZO |
分类号 |
C08L35/06;C08J5/24;C08L63/00;C08L71/12 |
主分类号 |
C08L35/06 |
代理机构 |
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