发明名称 POLYPHENYLENE ETHER RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyphenylene resin composition that has a low dielectric loss tangent and thus is suitably useful, for example, for a printed wiring board corresponding to the densification of wiring, a higher frequency signal etc. SOLUTION: The polyphenylene resin composition comprises (A) an epoxidized polyphenylene ether resin having a polyphenylene ether backbone part and (B) an aromatic vinyl compound-maleic anhydride copolymer having an aromatic vinyl backbone part. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009024064(A) 申请公布日期 2009.02.05
申请号 JP20070187358 申请日期 2007.07.18
申请人 ASAHI KASEI CHEMICALS CORP 发明人 SAKURAI MINORU;ONIZUKA KENZO
分类号 C08L35/06;C08J5/24;C08L63/00;C08L71/12 主分类号 C08L35/06
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