| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor element, having not only good transparency but also high adhesiveness to a metallic member such as a lead frame. <P>SOLUTION: The epoxy resin composition for sealing the optical semiconductor element contains the following components (A) to (D): (A) at least one of triglycidyl isocyanurate and an alicyclic epoxy resin having a specific structure; (B) a curing agent; (C) a silane coupling agent; and (D) an epoxy resin except the component (A). <P>COPYRIGHT: (C)2009,JPO&INPIT |
