| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of detecting the splicing of a carrier tape in an electronic component mounting apparatus which can realize a lower manufacturing cost and a simple component supply apparatus and prevent a decrease in productivity. <P>SOLUTION: There is provided the method of detecting the splicing of carrier tape in an electronic component mounting apparatus for mounting an electronic component supplied from a component supply apparatus on a printed-circuit board. The trailer of a carrier tape and the leader of another carrier tape are connected in such a manner that a splicing tape enclosing a splicing component is sandwiched. The electronic component is sucked by a suction nozzle at the component supply position of the component supply apparatus in the first step. In the subsequent step, the suction nozzle is transported and the electronic component is transported to a component recognition position. In steps S20-23, the splicing component is recognized by an image pickup apparatus for recognizing the electronic component. <P>COPYRIGHT: (C)2009,JPO&INPIT |
