| 摘要 |
PROBLEM TO BE SOLVED: To provide a Bi-Sn based solder paste, which contains≥58 wt.% Bi as a metal alloy powder, obtains high bonding-strength after bonding, and further generates no void even when an object to be bonded contains Au, and to provide a bonded article which has been bonded using the solder paste. SOLUTION: A solder paste includes 58-98 wt.% Bi, 0.01-0.5 wt.% V, and the balance Sn, as a metal alloy powder. Further, a bonded article which has been bonded using the solder paste is disclosed. COPYRIGHT: (C)2009,JPO&INPIT
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