| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing excellent in low stress generation. SOLUTION: The epoxy resin composition for sealing comprises (A) an epoxy resin, (B) a curing agent and (C) a compound having units expressed by structural formulae (I) and (II). In the formulae, R<SP>1</SP>expresses an alkylene group; R<SP>2</SP>and R<SP>3</SP>express each an alkyl group, a monovalent organic group having a 1-10C epoxy group or a 3-500C polyalkylene ether group. COPYRIGHT: (C)2009,JPO&INPIT |
