| 摘要 |
A microphone package includes a sound detection unit, which further includes a microphone chip for detecting sound and a control circuit for controlling the microphone chip, a substrate having a mount surface for mounting the microphone chip and the control circuit and a ring-shaped side wall, which projects upwardly from the mount surface so as to surround the sound detection unit, and a cover that is arranged above the substrate so as to form a hollow cavity with the mount surface and the ring-shaped side wall of the substrate. A sound hole establishing communication between the cavity and the external space is formed in a prescribed position of the substrate or the cover, wherein a recess or a projection is formed inside of the cover. A directional regulator is formed in the housing so as to block excessive pressure variations and environmental factors from being directed to the microphone chip.
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