发明名称 METHOD OF JUDGEMENT FOR JUNCTION STATE IN WIRE BONDING
摘要 PURPOSE:To enable the decision of quality of a junction state of wire by performing the detection by use of a force of pressing by a capillary, a friction force of supersonic oscillation and a piezoelectric element. CONSTITUTION:If a capillary 12 is in pressure-contact with a pellet 29 or a lead frame 30 at bonding, a piezoelectric element 28 being in contact with the lead frame 30 is applied a force of pressing and a friction force of supersonic oscillation so that the piezoelectric element 28 outputs an electric signal. The electric signal outputted from the piezoelectric element 28 is inputted in a filter 31 and the component except the predetermined frequency region by the filter 31. The electric signal passing through the filter 31 is amplified by an amplifier 32a and is converted to be digital by an A/D converting circuit 32 and is inputted in a comparative decision circuit 33. In this comparative decision circuit 3, the predetermined voltage value is preset in advance and a voltage value of the electric signal from the piezoelectric element 28 is compared with the preset value. The bonding state of a wire 14 is determined according to that comparative value.
申请公布号 JPS60117743(A) 申请公布日期 1985.06.25
申请号 JP19830225762 申请日期 1983.11.30
申请人 TOSHIBA KK 发明人 ATSUMI KOUICHIROU
分类号 B23K20/10;H01L21/60;H01L21/66 主分类号 B23K20/10
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