HEAT TRANSFER DEVICE AND MANUFACTURING METHOD THEREOF

摘要

A heat transfer device reducing the surface temperature of chip and manufacturing method thereof. The device comprises an airtight container (1) with vacuum inside, and a metal net (2) covering the inside surface of the airtight container (1), and a metal sheet (3) with vent hole (31) wrapped by metal net (2), and shores (32) fixed on the two surfaces of metal sheet (3), and a liquid working substance filled in the airtight container (1). The manufacturing method comprises the step of forming the shores (32) and the vent hole (31) simultaneously by pressing metal sheet.