| 摘要 |
PROBLEM TO BE SOLVED: To suppress heat transfer from a semiconductor element to a coil portion to reduce temperature rise of the coil portion in a module in which the semiconductor element is integrated with a transformer. SOLUTION: The module is provided with a first heat dissipation plate 8, a transformer 9 and semiconductor elements 10, 11 joined to the first heat dissipation plate 8, and a second heat dissipation plate 17 thermally joined to the transformer 9, wherein the transformer 9 has a core portion 12 and a coil portion 13 for generating magnetic field using the core portion 12 as an axis, the first heat dissipation plate 8 is face-joined to the core portion 12 and the second heat dissipation plate 17 is thermally face-joined to the coil portion 13. Thus, in the module in which the semiconductor elements 10, 11 are integrated with the transformer 9, the heat transfer from the semiconductor elements 10, 11 to the coil portion 13 can be suppressed and temperature rise of the coil portion 13 can be reduced. COPYRIGHT: (C)2008,JPO&INPIT
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