| 摘要 |
PROBLEM TO BE SOLVED: To suppress deterioration of pining strength of a pinned layer caused by ESD generated in a manufacturing process of a thin-film magnetic head, especially in a floating surface polishing process. SOLUTION: In the last floating surface polishing process for forming head elements on a wafer 600, cutting each row of wafers to construct a rover 25 to which a plurality of head elements are connected, polishing a surface which becomes a floating surface 2 of the rover 25 until an MR element height 21 is equal to a predetermined height, after that highly accurately finishing the floating surface 2 into a predetermined shape, and finishing surface roughness to a predetermined value, a conductive polishing liquid 39 is used. In order to suppress a pining failure occurrence rate by suppressing the deterioration of the pining strength of the pinned layer 13 of a reproducing element 5, the specific resistance of the conductive polishing liquid 39 is controlled to be 5 GΩcm or less, preferably 1 GΩcm or less. Then, a sallow groove rail 3 and a deep groove rail 11 are formed in the floating surface 2, and the rover 25 is cut to complete a thin-film magnetic head 1. COPYRIGHT: (C)2007,JPO&INPIT |
