发明名称 FOAMED MATERIAL HAVING LOW DIELECTRIC CONSTANT AND METHOD FOR PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a foamed material having a low dielectric constant, which is a thin film, is smooth and has heat resistance and to provide a method for producing the same. SOLUTION: The method for producing a formed material comprises: a process for holding a material in a container, raising pressure in the container to fixed pressure by using inorganic gas, heating the inside of the container to a given temperature and keeping the temperature for a fixed time; and a process for reducing the pressure to atmospheric pressure after passage of a fixed time. The formed material has 1.0-3.0 dielectric constant, 10%-90% porosity, and 0.01-10μm average pore diameter. The material is a polyamide such as a thermoplastic polyimide, a polyether imide, etc. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006111708(A) 申请公布日期 2006.04.27
申请号 JP20040299738 申请日期 2004.10.14
申请人 INOAC CORP;INOAC GIJUTSU KENKYUSHO:KK 发明人 NISHIMURA HIROYUKI;KUME KOJI;IIZUKA TAKESHI;YAMAZAKI KAE
分类号 C08J9/12;C08L79/08 主分类号 C08J9/12
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