发明名称 |
Plating substrate, electroless plating method, and circuit forming method using the same |
摘要 |
An electroless copper plating method is provided having a first catalyst step of forming a first catalyst layer on a ceramic base material containing a glass component using a tin chloride solution and a palladium chloride solution; a pre-copper-plating heat treatment step of heating the ceramic base material in an atmosphere containing oxygen; a laminate catalyst treatment step of forming a laminate catalyst layer on the ceramic base material using a tin chloride solution and a palladium chloride solution; a plating treatment step of forming a copper plating film on the ceramic base material using a copper plating solution containing a small amount of nickel ions; and a post-copper-plating heat treatment step of heating the ceramic base material at a heat treatment temperature not more than the glass transition temperature thereof.
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申请公布号 |
US2006088705(A1) |
申请公布日期 |
2006.04.27 |
申请号 |
US20050251349 |
申请日期 |
2005.10.14 |
申请人 |
ALPS ELECTRIC CO., LTD. |
发明人 |
MITSUMORI KENICHI |
分类号 |
B32B3/00;B32B9/00;B32B15/04;B32B17/06;B32B18/00;B32B19/00 |
主分类号 |
B32B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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