| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist-applying method which enables a deposition of a resist film of uniform thickness on the surface of a nearly circular substrate without forming an edge bead on its peripheral part, and also to provide a coating device used for the method. SOLUTION: In the resist-applying method, a substrate 1, which is horizontally adsorbed and held, is rotated to move a nozzle 13, along its diameter, nearly from the center of the substrate 1 to its outer peripheral part, and a resist is fed from the nozzle 13 to apply the resist, in a spiral locus, to the surface of the substrate 1. In addition, the concave or convex of the surface of the substrate 1 is preliminarily measured along the spiral locus, and then the resist is applied from the result of the measurement while keeping an interval between the substrate 1 and the nozzle 13 constant. COPYRIGHT: (C)2008,JPO&INPIT
|
