发明名称 |
MANUFACTURING METHOD OF LIGHT EMITTING ELEMENT MOUNTING WIRING BOARD AND LIGHT EMITTING ELEMENT MOUNTING WIRING BOARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting element mounting wiring board and a light emitting element mounting wiring board capable of enhancing heat radiation efficiency and of keeping light emission efficiency high over a long period of time. <P>SOLUTION: The manufacturing method of a light emitting element mounting wiring board 1 on which a light emitting element is mounted includes a bonding process of bonding a substrate part 2 on which the light emitting element is provided and an aluminum reflecting plate 3 undergoing mirror surface processing via a bonding sheet 5. The reflecting plate 3 can enhance heat radiation efficiency and light emission efficiency. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2008300773(A) |
申请公布日期 |
2008.12.11 |
申请号 |
JP20070148044 |
申请日期 |
2007.06.04 |
申请人 |
DAISHO DENSHI:KK |
发明人 |
OWAKI TOSHIO;MASABAYASHI MIKIO;ISOMURA TOMOKATSU;KOYAMA MITSURU |
分类号 |
H01L33/64;H05K1/02;H05K1/05 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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