发明名称 MANUFACTURING METHOD OF LIGHT EMITTING ELEMENT MOUNTING WIRING BOARD AND LIGHT EMITTING ELEMENT MOUNTING WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting element mounting wiring board and a light emitting element mounting wiring board capable of enhancing heat radiation efficiency and of keeping light emission efficiency high over a long period of time. <P>SOLUTION: The manufacturing method of a light emitting element mounting wiring board 1 on which a light emitting element is mounted includes a bonding process of bonding a substrate part 2 on which the light emitting element is provided and an aluminum reflecting plate 3 undergoing mirror surface processing via a bonding sheet 5. The reflecting plate 3 can enhance heat radiation efficiency and light emission efficiency. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008300773(A) 申请公布日期 2008.12.11
申请号 JP20070148044 申请日期 2007.06.04
申请人 DAISHO DENSHI:KK 发明人 OWAKI TOSHIO;MASABAYASHI MIKIO;ISOMURA TOMOKATSU;KOYAMA MITSURU
分类号 H01L33/64;H05K1/02;H05K1/05 主分类号 H01L33/64
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