| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for surface-treating a polyimide resin layer, improving the bonding force of the polyimide resin layer by leaps and bounds with a simple surface treatment and also improving the bonding force even in a low roughness copper foil suitable for fine pitch formation, and a method for producing a copper cladding laminated plate used for a high density printed wiring board. SOLUTION: This method for surface-treating the polyimide resin layer comprises a contact-treating process of contact-treating the layer of the surface side of the polyimide resin layer by an organic treating agent having at least 2 amino groups and expressed by formula: H<SB>2</SB>N-CH<SB>2</SB>-A-CH<SB>2</SB>-NH<SB>2</SB>[wherein, A is a divalent organic group and also the number of carbon atoms contained in the A is 2 to 18] to form a surface contact-treated layer, and a modified imidation layer-forming process of heat-treating the surface contact-treated layer to form the modified imidation layer. COPYRIGHT: (C)2009,JPO&INPIT |
