| 摘要 |
An apparatus for polishing a substrate surface such as a semiconductor wafer or the like by Chemical Mechanical Planarization (CMP) comprises a rotatable wafer platen which is held against a conical body having a polishing pad which contacts the wafer along tangential length of the curved surface of the conical body. The polishing pad is optionally a belt tensioned over the conical body or a conical pad securely mounted to the conical body. The apparatus includes a housing or process vessel to encapsulate substantially the process interface region, particulary where a chemical slurry is used in the polishing media. A method of polishing a substrate, such as a semiconductor wafer, is also disclosed. The method optionally includes immersion of the process interface in polishing media.a
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