LIGHT-EMITTING DIODE PACKAGE

摘要

A light-emitting diode (LED) package including a carrier, a pair of conductive wire units, an LED chip, and a control circuit module is provided. The carrier has a carrying portion and a ring frame connected to the periphery of the carrying portion. The carrying portion has a dome-like upper surface and a pair of through holes. The pair of conductive wire units is disposed inside the through holes respectively, and each of the conductive wire units has a conductive wire and an insulating material encapsulating the conductive wire. The LED chip is disposed on the upper surface of the carrier and is electrically connected to the conductive wires. The control circuit module is disposed at a bottom of the carrier and is electrically connected to the conductive wires for controlling the operation of the LED chip.