| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component with a photoelectric conversion element which can be reduced in size and manufacturing cost and can be improved in installation accuracy, to provide a substrate equipped with the electronic component, and also to provide methods of manufacturing the electronic component and the substrate. SOLUTION: In the electronic component 1 equipped with the photoelectric conversion element (VCSEL) 10, a driving electrode formed in an edge portion of the surface whereon a light-emitting portion of the photoelectric conversion element 10 exists and an electrode for element connection formed in a light-transmitting member 20 so disposed as to face the surface whereon the light-emitting portion of the photoelectric conversion element 10 exists are laser-bonded via a conductive bonding material 40. On the surface of the light-transmitting member 20, an antireflection film 21 may be formed. On the photoelectric conversion element-side surface of the light-transmitting member 20, an interconnection 30 consisting of the electrode for element connection, an electrode for substrate connection, and an electrode connecting portion is formed. As a material of the interconnection 30, a material which allows easy transmission of laser light used for laser bonding (for example, aluminum, gold, or copper) can be used. COPYRIGHT: (C)2009,JPO&INPIT |
