| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of determining positions at which semiconductor chips are mounted, the semiconductor device mounted with the plurality of semiconductor chips on the same die pad. <P>SOLUTION: Semiconductor chips 4a, 4b are fixed on a die pad 2a by an under-filler 6 of which the thermosetting temperature is lower than or equal to a fusing point temperature of a dice bond material 5, thereby preventing the semiconductor chips 4a, 4b from moving when fusing the dice bond material 5. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
