发明名称 SOLDERING METHOD FOR SEMICONDUCTOR OPTICAL DEVICE, AND SEMICONDUCTOR OPTICAL DEVICE
摘要 A method for soldering a semiconductor optical device including a resin-made optical lens to an object by a reflow soldering process using a lead-free solder, and a semiconductor optical device for use in the method. A semiconductor optical device including a silicone resin-made optical lens as the resin-made optical lens is used;
申请公布号 US2008277683(A1) 申请公布日期 2008.11.13
申请号 US20080176824 申请日期 2008.07.21
申请人 ASAHI RUBBER INC. 发明人 TASAKI MASUTSUGU;OZAWA KENICHI
分类号 H01L21/00;H01L33/58;H01L33/62 主分类号 H01L21/00
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