| 摘要 |
PROBLEM TO BE SOLVED: To provide an sucking hand for carrying a thin wafer, preventing an external circumferential portion of the wafer from warpage or bending due to hanging down by initially sucking the internal circumferential portion when the thin wafer is sucked. SOLUTION: The sucking hand 1 for carrying a thin wafer is configured so that: a plurality of wide external circumferential sucking air chamber circumferential grooves 13 and 131-136 communicating with a first communicating passage 12, and a plurality of narrow internal circumferential sucking air chamber circumferential grooves 15 and 151-155 communicating with a second communicating passage 14, are provided on an sucking surface 11 of the sucking hand 1 for carrying a thin wafer; the first communicating passage 12 is selectively connected to a vacuum pump HVP30 having high degree of vacuum or a low-pressure air pressure pump LP40 via a first throttle valve 21 having a large cross sectional area; and the communicating passage 14 is selectively connected to a vacuum pump LVP31 having low degree of vacuum or the low-pressure air pressure pump LP40 via a second throttle valve 22 having a small cross sectional area. With this configuration, the thin wafer 2 is sucked on the sucking surface 11 and transferred or carried to a predetermined position, the vacuum of high degree of vacuum and the vacuum of low degree of vacuum are destroyed, and the low-pressure air pressure pump LP40 is operated to place the thin wafer 2 at the predetermined position. COPYRIGHT: (C)2009,JPO&INPIT |
