COMPOSITE STRUCTURE WITH ORGANOPHOSPHONATE ADHERENT LAYER AND METHOD OF PREPARING

摘要

The present invention provides an article comppsmg a substrate having a surface and comprising electrodeposited copper foil or copper alloy foil, an adherent layer serving to promote adhesion, comprising at least one organophosphonate or salt thereof covalently bound to the surface, and a functional layer, comprising at least one polymer bound to the adherent layer. The present invention further provides devices comppsing a heat source or electronic component and the article described above, wherein the heat source is in thermal contact with the substrate and the electronic component is in electpcal contact with the substrate. Also provided is a method of producing the above-described article.