| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a heat-dissipating function using a heat pipe. SOLUTION: A chip unit 10 has semiconductor chips 11, metallic wirings 23 supporting the semiconductor chips, wiring supporting substrates 22 supporting the metallic wirings 23 and a heat pipe 40 connected to the wiring supporting substrates 22 in a thermally conductible manner. The chip unit 10 further has a heat sink member 21 connected to the wiring supporting substrates 22 and the heat pipe 40 in the thermally conductible manner and exposed in a region making an external heat exchanging medium flow. The heat sink member 21 and the wiring supporting substrates 22 are composed of a material having the small difference of a coefficient of thermal expansion with the semiconductor chips 11 and having a thermal conductivity higher than the semiconductor chips 11. The heat pipe 40 is extended up to a region protruded from a natural heat-dissipating region, and cooled by the central section 21A and side sections 21B of the heat sink member 21. COPYRIGHT: (C)2009,JPO&INPIT |
