发明名称 |
Mechanical packaging of surface acoustic wave device for sensing applications |
摘要 |
A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.
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申请公布号 |
US2008265711(A1) |
申请公布日期 |
2008.10.30 |
申请号 |
US20070799346 |
申请日期 |
2007.04.30 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
KUMAR SACHIN;COOK JAMES D.;O'BRIEN GARY;QASIMI MOHAMMED AJ.;SORENSON RICHARD C.;MARSH BRIAN J.;AVRAMESCU VIOREL V. |
分类号 |
H02N2/18;H01L41/22 |
主分类号 |
H02N2/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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