| 摘要 |
<p>Apparatus for the cooling of high power type semiconductor elements, especially thyristors in electrically powered vehicles, has one or more bubble pumps which are placed into direct heat-exchanging contact with a semiconductor element and are connected with the vessel of a liquid-collecting vapor separator containing a supply of liquid coolant which evaporates at temperatures developing when the semiconductor element is under load and heats the pump or pumps. The separator is connected with an air-cooled condenser, and the condensate is returned to the pump or pumps, either by way of the vessel or by way of an injector which also receives liquid coolant from the separator. Each bubble pump has a current-conducting housing whose chamber is subdivided into several passages having a cross-sectional area which increases in a direction from the liquid-admitting inlet toward the vapor-discharging outlet of the pump.</p> |
