BASE-EQUIPPED INSULATING SHEET, MULTI-LAYER PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND MULTI-LAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD

摘要

It is possible to provide a base-equipped insulating sheet in which the base can easily be peeled off from the insulating sheet without causing a crack or drop of the insulating layer when used for the insulating layer of the multi-layer printed circuit board. It is also possible to provide a multi-layer printed circuit board and a semiconductor device. The base-equipped insulating sheet is used to form an insulating layer of the multi-layer printed circuit board. An insulating layer is formed on the base by a resin component. The insulating layer is attached to an attachment surface with heat and pressure. After the insulating layer is heated and hardened, the base is peeled off from the insulating layer with a peeling-off intensity not greater than 0.2 kN/m. The insulating layer is peeled off from the base after heating and hardening. The insulation layer formed by the resin component is arranged on the base and the insulating layer is attached to the attachment surface while being heated by temperature of 60 to 160 degrees C and pressed with a pressure of 0.2 to 5 MPa for 0.5 to 15 minutes. At the temperature of 20 degrees C, the base can be peeled off from the insulating layer with a peeling-off intensity not greater than 0.05 kN/m.