| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid semiconductor encapsulating material capable of obtaining a semiconductor device with high reliability, and the semiconductor device with high reliability. SOLUTION: The liquid semiconductor encapsulating material includes an epoxy resin (A), an acid anhydride hardener (B), and 0.01-10 wt.% of a compound (C) having a ketimine structure. More specifically, the liquid semiconductor encapsulating material further includes a hardening accelerator (D). More specifically, the constituent (B) is an acid anhydride hardener, and the constituent (D) is an amine hardening accelerator. COPYRIGHT: (C)2009,JPO&INPIT
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