| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device wherein an overflow of resin injected between an electronic part and a circuit substrate is suppressed. SOLUTION: In an electronic part 2 wherein a plurality of terminal electrodes 2a are formed on its lower surface, the terminal electrodes 2a are mounted to a circuit substrate 1 wherein a plurality of electrode pads 1a are formed on its upper surface, being opposite to the electrode pads 1a. A groove 4 having a discontinuous part 4a is formed on the upper surface of the circuit substrate 1 to surround the electrode pads 1a so that the surrounded area 8 may be located inside the outer circumference 2b of the electronic part 2, and a resin 3 is injected into the area 8 surrounded by the groove 4 between the electronic part 2 and the circuit substrate 1, thus forming the electronic device 10. The resin 3 is injected into the discontinuous part 4a of the groove 4, so that the inside of the area 8 surrounded by the groove 4 is first filled with the resin 3. An overflow of the resin 3 is suppressed by the surface tension thereof at an opening of the groove 4, reducing the overflow of the injected resin 3. COPYRIGHT: (C)2009,JPO&INPIT
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