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经营范围
发明名称
Grooves formed around a semiconductor device on a circuit board
摘要
申请公布号
USD577691(S1)
申请公布日期
2008.09.30
申请号
US20080303833F
申请日期
2008.02.19
申请人
NITTO DENKO CORPORATION
发明人
OHSAWA TETSUYA;TANI EMIKO
分类号
主分类号
代理机构
代理人
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