SOLDER JOINING MATERIAL, ITS MANUFACTURING METHOD, AND POWER MODULE SUBSTRATE UTILIZING THE SOLDER JOINING MATERIAL

摘要

PROBLEM TO BE SOLVED: To enhance the soldering reliability in a soldered part without lowering the heat conductivity. SOLUTION: A soldering material 11 comprises a foamed metallic material, a Ni or Ni-alloy film, and a soldering material. The foamed metallic material is formed into a three-dimensional reticular porous one by Cu or a Cu alloy. Further, the Ni or Ni-alloy film covers the entire or a part of the surface of the foamed metallic material. Still further, the soldering material mainly consists of Sn, and the soldering material is filled in the foamed metallic material covered by the Ni or Ni-alloy film. COPYRIGHT: (C)2008,JPO&INPIT