| 摘要 |
PROBLEM TO BE SOLVED: To provide a barrel plating apparatus capable of uniforming current density distribution on the surface of a material to be plated in a barrel container, thereby minimizing variation in the plating film thickness of the material to be plated. SOLUTION: A plurality of opening parts 4a-4d are formed on the side wall part 3 of the barrel container 1, each opening part is covered with a mesh 5 through which the plating solution is passed and the mesh is held with frame parts 6a, 6b surrounding the opening parts. The barrel container 1 is dipped in the plating bath and rotated by horizontally supporting the axial center part of the end wall part to electroplate the material to be plated which is housed in the barrel container. The ratio of the length between the opening parts 4a-4d and the frame parts 6a, 6b in the barrel container rotating direction is substantially made constant at an optional point excluding the vicinity of both end wall parts of the barrel container 1 in the axial direction. COPYRIGHT: (C)2008,JPO&INPIT
|
