| 摘要 |
A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2 , having a bottom surface 2 b and an element mounting surface 2 a which is positioned on the opposite side of bottom surface 2 b, and a semiconductor element 1 , having a main surface 1 a which is mounted onto element mounting surface 2 a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2 b and element mounting surface 2 a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2 a is a cavity 2 u, and element 1 is provided in cavity 2 u. A metal layer 13 is provided on the surface of cavity 2 u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1 a, on the cavity side of the part which connects with electrode 32 , main surface 1 a is provided with a groove. The groove is for preventing outward flow of connection member 34 of electrode 32.
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