| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for which fall-out of the semiconductor device from a heat radiator can be suppressed while reducing stress applied to a semiconductor element during press fitting. SOLUTION: The semiconductor device 1 is provided with a metal boss 2, a semiconductor element 3, a lead terminal 4, a support electrode 5 and a protective member 6. The semiconductor element 3 is attached to the support electrode 5 through solder and the metal boss 2. In the state of being attached to the heat radiator 50, the outer peripheral part of the support electrode 5 is pressed by the heat radiator 50. On the outer peripheral part of the support electrode 5, a plurality of first grooves 11 and a plurality of second grooves 12 crossing the first grooves 11 are formed. COPYRIGHT: (C)2009,JPO&INPIT
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