| 发明名称 |
Solder wave process for solder shunts for printed circuit board |
| 摘要 |
A method of making a printed circuit board having zero resistance connections. Pairs of shunt pads are formed on the board, spaced sufficiently far apart to avoid short circuiting but sufficiently close to permit a solder bridge to occur between them during a solder wave process.
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| 申请公布号 |
US7410093(B2) |
申请公布日期 |
2008.08.12 |
| 申请号 |
US20040967839 |
申请日期 |
2004.10.18 |
| 申请人 |
DELL PRODUCTS L.P. |
发明人 |
MILLER KEVIN L.;MCMILLAN THAD C. |
| 分类号 |
B23K31/02;H05K1/00;H05K3/28 |
主分类号 |
B23K31/02 |
| 代理机构 |
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代理人 |
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