| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold device which can remarkably improve a temperature adjustment effect to the mating face of a mold. SOLUTION: The adhesion between a temperature adjustment tube 14 and the inner wall of a groove 13 is improved by press fitting, and an adhesive 16 having heat conductivity higher than the temperature adjustment tube 14 is packed in a closed space 15 between the temperature adjustment tube 14 and the groove 13, so that the thermal conductivity from the temperature adjustment tube 14 to a parting surface is improved. COPYRIGHT: (C)2008,JPO&INPIT
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