发明名称 Release film
摘要 It is an object of the present invention to provide a release film which is superior in the flexibility at high temperature, the conformability to circuit patterns, the heat resistance, the releasing property and the non-contaminative property, and easily discarded after use. The present invention relates to a release film, which is used in a manufacturing process of a printed-circuit board, a flexible printed-circuit board or a multilayer printed-circuit board, having a layer comprising a resin composition comprising a resin having a polar group in a main chain as a matrix and having a halogen content of 5% by weight or less on at least one surface.
申请公布号 US7407712(B2) 申请公布日期 2008.08.05
申请号 US20050549115 申请日期 2005.11.14
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 MATSUMOTO HIROTAKE;SHIRATO HITOSHI;INOUE HIDEKAZU
分类号 B32B27/36;C08J5/18;C08L67/00;H05K1/00;H05K3/02;H05K3/46 主分类号 B32B27/36
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