| 发明名称 |
Printed circuit board having axially parallel via holes |
| 摘要 |
Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole.
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| 申请公布号 |
US7408120(B2) |
申请公布日期 |
2008.08.05 |
| 申请号 |
US20050042360 |
申请日期 |
2005.01.24 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM YOUNG WOO;MIN BYOUNG YOUL;RYU CHANG MYUNG;KIM HAN |
| 分类号 |
H01R12/04;H05K1/11;H05K3/42;H05K3/46 |
主分类号 |
H01R12/04 |
| 代理机构 |
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