| 发明名称 |
EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR, AND OPTICAL SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing optical semiconductors that has good moldability, external appearances, and moisture resistance reliability and exhibits excellent heat discoloration resistance. <P>SOLUTION: The epoxy resin composition comprises as essential ingredients an epoxy resin, a curing agent and a curing accelerator, and contains hydrogenated methylnadic acid as the curing agent and a quaternary phosphonium salt of an organic acid as the curing accelerator. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| 申请公布号 |
JP2008174626(A) |
申请公布日期 |
2008.07.31 |
| 申请号 |
JP20070008508 |
申请日期 |
2007.01.17 |
| 申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
YAMAMOTO TAKAYUKI;NAKASUJI IKUO |
| 分类号 |
C08G59/42;C08G59/68;H01L23/29;H01L23/31;H01L33/56 |
主分类号 |
C08G59/42 |
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