| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition apparatus which can stably deposit a film with a uniform thickness on a substrate with a large area. SOLUTION: The film deposition apparatus is provided with: an injector 3 having nozzles 11A, 11B, 11C blowing onto a substrate 9a, gaseous starting material of a film to be formed; and exhaust flow passages 17 each of which exhausts the blown gaseous starting material from a space between a substrate 9 and the injector 3 and each of which is formed between a pair of confronted faces 13, 15. When the length along the flowing direction in which the gaseous starting material flows in the exhaust flow passage 17 is defined as L and the length in the space direction between a pair of the faces 13, 15 as W, the value of the pressure loss in the exhaust flow passage 17 as a function of L/W<SP>2</SP>is a prescribed threshold or above. COPYRIGHT: (C)2008,JPO&INPIT
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