ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

Provided is an electronic circuit device wherein a pair of substrates are arranged in the vertical direction and the periphery of the lower substrate is filled with a filling material. The electronic circuit device is small and low-cost, with high vibration resistance and high reliability of the upper substrate. The electronic circuit device is provided with a lower substrate (5) whereupon a main circuit is formed; an upper substrate (6) whereupon a drive control circuit is formed for drive-controlling the main circuit; and a resin case (3), which has an external extraction terminal (9) of the main circuit and the drive control circuit on an external surface of a peripheral section, and has a substrate storing space inside the peripheral section. A space above the lower substrate (5) is filled with the filling material by arranging the upper substrate (6) above the lower substrate (5). The filling material is composed of a resin, and a supporting body (2), which is positioned and fixed above the lower substrate with the resin in a cured state, is arranged, and the upper substrate (6) is fixed and supported by the supporting body (2).