ELECTRODE STRUCTURE AND METHOD FOR FORMING BUMP

摘要

Disclosed is an electrode structure (100) on which a solder bump is placed. This electrode structure (100) comprises an electrode pattern (50) made of an electrode-constituting material selected from the group consisting of Cu, Al, Cr and Ti, a Ni layer (52) formed on a part of the electrode pattern (50), a Pd layer (54) formed on at least a part of the other region of the electrode pattern (50) where the Ni layer (52) is not formed, and a Au layer (56) formed on the Ni layer (52) and the Pd layer (54).