| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a carrier head suitable for CMP (Chemical Mechanical Polishing) of semiconductor. <P>SOLUTION: The carrier head includes: a housing 102; a base assembly 104; a holder ring 200; a carrier ring 400; and flexible membranes 300 and 500. The base assembly 104 can move to and from the housing 102 vertically. The holder ring 200 is connected to the base assembly 104 through a first flexible membrane 300, can move to and from the base assembly vertically, has an under surface constituted so as to contact with a polishing pad, and has an inner peripheral surface constituted so as to hold a substrate 10 by surrounding an edge of the substrate. The carrier ring 400 is connected to the base assembly 104 being fixed vertically to the base assembly, surrounds the holder ring in order to prevent horizontal movement of the holder ring 200, and has an under surface constituted so as to contact with the polishing pad. <P>COPYRIGHT: (C)2008,JPO&INPIT |
