| 摘要 |
A singulation metal mold for singulating a plurality of semiconductor devices arrayed on a TAB tape has a punch as an upper metal mold of the singulation metal mold, a die block as a lower metal mold of the singulation metal mold, a knockout disposed to be slidable vertically inside a vertical hole formed in the die block, the knockout being operable to press up above the die block each of the singulated semiconductor devices left on the die block after the singulating, a press-up plate positioned under the knockout to support the knockout and linked mechanically to the knockout, and being operable to forcibly move the knockout vertically when the press-up plate moves vertically; and a press-up plate descent forcing mechanism that is operable to forcibly pull down the press-up plate.
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