MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD

摘要

A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a mediate layer 38 provided on a pad 24 of the IC chip 20 . Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer 38 made of copper on the die pad 24 , it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.