| 摘要 |
Proposed is a method for producing a portable data carrier ( 100 ) starting out from a film carrier ( 10 ) having disposed on its upper side ( 14 ) a contact layout ( 28 ), and on its underside ( 16 ) a semiconductor circuit ( 20 ) connected to the contact layout. The thus prepared film carrier ( 10 ) is put into an injection mold ( 30 ) where an injection molding process is performed in which a molded body ( 40 ) having an outer contour ( 102 ) corresponding to a standard specification for the outer dimensions of a portable data carrier is formed on the underside ( 16 ) around the semiconductor circuit ( 20 ).
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