| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip transfer apparatus in which a chip is not damaged, the transfer point is not soiled, and poor suction of a collet is prevented. <P>SOLUTION: The chip transfer apparatus 10 includes a stage moving in the X direction and the Y direction while mounting a wafer split into a plurality of chips, a collet capable of picking up every chip from the wafer mounted on the stage and moving in the Z direction, a rotatable head moving in the X direction and the Y direction while arranging eight collets, and a monitor for monitoring the collets through an image. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
