发明名称 ALUMINUM FOIL FOR PRINTED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide aluminum foil for printed circuit by which, when forming a printed circuit, chemical solubility at etching can be improved and further the edge shape of a circuit line can be improved. SOLUTION: The aluminum foil for printed circuit has a composition consisting of 0.01 to 0.2% Si, 0.01 to 0.5% Fe, 0.01 to 0.05% Cu, 0.002 to 0.05% Ni and the balance Al with inevitable impurities. It is preferable that, in this aluminum, Ni-containing precipitates are dispersed in a density of 10<SP>4</SP>to 10<SP>6</SP>pieces/cm<SP>2</SP>. By this invention, excellent chemical solubility can be exhibited at etching and also the edge shape of the circuit line can be made excellent in sharpness characteristics, and the formation of a high-density circuit can be excellently performed. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008121090(A) 申请公布日期 2008.05.29
申请号 JP20060308818 申请日期 2006.11.15
申请人 MITSUBISHI ALUM CO LTD 发明人 ENDO MASAYA;WATANABE HIDEO
分类号 C22C21/00;H05K1/09 主分类号 C22C21/00
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