发明名称 Light emitting diode package with large viewing angle
摘要 A light emitting diode package with large viewing angle includes a substrate, a LED chip, transparent housing body, and phosphor matrix. The substrate has an upper surface with a first electrode and a second electrode and a lower surface opposite to the upper surface. The LED chip with a positive electrode and an opposite electrode, the LED chip is mounted on the upper surface of the substrate, and connected from the positive electrode to the first electrode of the substrate by wire, and connected from the negative electrode to the second electrode by wire. The transparent housing body glue is molded on the upper surface of the substrate, and it surrounds the LED chip. And the phosphor matrix is coated on the LED chip, so that the light emitted from the LED chip may turn into white light through the phosphor matrix, and the white light from the LED chip may penetrate the laterals of the transparent housing body. Thus, more lumens are gained and the viewing angle are wider.
申请公布号 US2008121922(A1) 申请公布日期 2008.05.29
申请号 US20070698706 申请日期 2007.01.25
申请人 CHEN HSING 发明人 CHEN HSING
分类号 H01L29/22;H01L33/48;H01L33/50;H01L33/58;H01L33/60 主分类号 H01L29/22
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