| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board with which an insulating film can be formed without generating a gap around an IC chip, and a manufacturing method of a mutlilayer wiring board. <P>SOLUTION: The manufacturing method of a wiring board includes a cutting step of fixing a semiconductor wafer 21 having a plurality of IC chips 13 formed thereon on a dicing tape 22, and cutting the wafer 21 into individual IC chips 13; a lyophillic processing step of applying lyophillic processing to the surface of each of the IC chips 13 in a state where the wafer 21 is fixed on the dicing tape 22; and an insulating film forming step of separating the singulated IC chips 13 from the dicing tape 22 to dispose them on the substrate and forming an insulating film around each of the IC chips 13. <P>COPYRIGHT: (C)2008,JPO&INPIT |
