| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning composition for cleaning microelectronic substrates, and specifically the cleaning composition useful with and having improved compatibility with the microelectronic substrates characterized by silicon dioxide, sensitive low-κor high-κdielectrics and copper, tungsten, tantalum, nickel, gold, cobalt, palladium, platinum, chromium, ruthenium, rhodium, iridium, hafnium, titanium, molybdenum, tin and other metallizations, as well as Al or Al (Cu)-coated substrates and advanced interconnection technologies. SOLUTION: The microelectronic cleaning compositions containing halogen oxygen acid, salt of the acid and derivatives thereof are used. COPYRIGHT: (C)2008,JPO&INPIT |
